CEVA to Showcase Advanced Communication and Multimedia Applications at Mobile World Congress 2012
CEVA, Inc., the licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the mobile handset, portable and consumer electronics markets, announced that it will demonstrate mobile DSP technology for advanced communications and multimedia applications at Mobile World Congress (News - Alert) 2012, taking place in Barcelona, Spain from February 27th through March 1st.
CEVA will also showcase a range of smartphones, feature phones, tablets and other mobile computing devices that are powered by CEVA (News 
- Alert) DSPs.
In order to reduce the cost, complexity, and risk in bringing products to market, CEVA has developed a suite of System Platforms and Solutions. These combine the hardware and software elements that are essential for designers deploying CEVA’s state-of-the-art DSP and IP cores.
Platforms on display at CEVA's stand will include Virtual Mouse, Touch-Free Interface - Together with CEVAnet partner eyeSight, CEVA will demonstrate eyePoint, a virtual mouse interface, combining finger tracking with face detection for mobile devices, running on the CEVA-MM3101 development platform. Video Stabilizer will be demonstrated, which is a software-based video stabilizer running on the CEVA-MM3101 development platform.
Another platform is Software-based LTE (News - Alert) Baseband. With CEVA-XCnet partner mimoOn, CEVA will demonstrate a live 20Mbps transport of HD video streams over LTE using MIMO2*2 and 64QAM. Software-based DTV Demodulation is another platform to be demonstrated. Together with CEVA-XCnet partner Idea! Electronic Systems, CEVA will demonstrate its multi-standard software-based demodulation solution with a live demonstration of ISDB-T signals running on the new CEVA-XC silicon-based software development kit.
Digital signal processing is a key technology that is powering many growing electronics markets. Digital signal processors (DSPs) are specialized high-speed microprocessors that are optimized for performance in applications requiring repetitive arithmetic calculations to be performed on arrays of data. DSPs provide the silicon foundation supporting the vast majority of electronic products.
In other news, CEVA, Inc. (News - Alert) recently announced the availability of a new silicon-based, software development kit (SDK) for runtime software development based on the CEVA-XC323 DSP architecture.
Anamika Singh is a contributing editor for TMCnet. To read more of Anamika's articles, please visit her columnist page.Edited by
Jennifer Russell
